Construction will begin in the third quarter of 2025 with the aim to be operational in the third quarter of 2026.

ĐÀ NẴNG – The central city’s people’s committee has agreed an investment proposal on the development of the first semiconductor advanced packaging laboratory project by the VSAP LAB joint-stock company with an investment of 1.8 trillion (US$72 million).
The investor plans to build its R&D centre on an area of 2.298sq.m at the newly-built Đà Nẵng Software Park No 2.
Construction will begin in the third quarter of 2025 with the aim to be operational in the third quarter of 2026.
It will provide 10 million of products in different fields of hi-tech industries and semiconductor and AI each year.
Đà Nẵng City has been working with Arizona State University in providing training courses in microchip design and in Assembling, Testing and Packaging (ATP).
The city reported that the information technology and communications industry earned revenues of $1.6 billion in 2024, and the digital economy contributed 21 per cent to the city’s Gross Regional Domestic Product (GRDP).
Up-to-date, 14 businesses are operating chip design and semiconductor facilities in the city, including Synopsys, Uniquify, Renesas, Synapse (now Quest Global), Sannei Hytechs, Mixel Việt Nam, Marvell Việt Nam, Sibridges Việt Nam, Ideas2Silion Việt Nam, FPT Semiconductor, Viettel Hi-Tech and Acronics.
Đà Nẵng has four centralised information technology (CIT) zones including Đà Nẵng Software Park, Đà Nẵng IT Park, FPT Complex and Software Park 2, attracting a total staff of 53,000 working across a variety of digital industries. VNS